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Printed circuit board surface finish

2020/08/14

Printed circuit board surface finish

The circuit board surface is responsible for raising the wetting ability of the contact areas for soldering; non-chemical surfaces serve simultaneously as protection against oxidation of the covered copper and improve shelf life characteristics. 

The circuit board surfaces vary in shelf life, typical application field and price, but are normally specified by the process, product or desired location for the application.

Available surfaces

SurfacePCB RoHS-compliantPCB solderingPCB Bonding aluminium wirePCB Bonding gold wirePCB BGAPCB Flex-/Rigid-FlexPCB PressfitPCB PCI contactsPCB sliding contactPCB surface thicknessPCB shelf lifePCB Reflow Cycles
Hal SnPb
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>5µmca.12 months5
HAL lead-freecheckcheck



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>5µmca. 12 months5
Chemical tincheckcheck



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>1µmca. 6 months5
Chemical silvercheckcheckcheck


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0.2 - 0.3µmca. 12 Monate5
Chemical gold
ENIG
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3-6µm Ni
0.05-0.1µm Au
ca. 12 months5
ENEPIGcheckcheckcheckcheckcheck
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3-8µm Ni
0.05-0.15µm Pd
0.05-0.1µm Au
ca. 12 months-
Galvanic softgoldcheckcheck
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4 - 6µm Ni
>1µm Au
ca. 12 months-
Galvanic hardgoldcheck





checkcheck4 - 6µm Ni
0.1 - 2µm* Au
ca. 12 months
on request
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HAL SnPb

HAL SnPb (lead-tin) is nowadays allowed only in certain technology fields such as medicine and space travel. HAL is suitable for standard SMD, but shows weaknesses in fine pitch applications. A chemical surface is preferable for finepitch.

PCB surface HAL SnPb

  • Advantages:

  • Good solderability               

     


  • Good reflow properties

Disadvantages:

Chemical tin

The surface chemical tin is for manufacturing reasons rarely requested any more! Due to the rapid oxidation of the copper, the shelf life is highly dependent on temperature and packaging. Fingerprints on the surface should be avoided at all.

PCB surface chemical tin (immersion tin)

Advantages:

  • Absolutely flat

  • Good for fine pitch

  • Good for SMD

  • Good for press-fit

Disadvantages:

  • Extra charge

  • Critical manufacturing process

  • Faster oxidation, thus:

  • Limited storability

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