 |
|
| |
Business / Flexible Printed
Circuit |
 |
| |
| Production Capabilities
of Flexible Printed Circuit |
|
| FPC |
| Material & Thickness (¦Ìm) |
Polyimide (25,50,75,100) |
| Polyester (25,50,75,100) |
| Max. Layers: |
4- layer |
Material Copper Thickness (¦Ìm):
|
18,35,50,70,105 |
| Minimum trace/space: |
0.10 / 0.10 mm |
Min. Hole Dia:
|
0.25 mm |
| True Position: |
¡À0.20 mm |
Solder Heat Resistance:
|
260¡æ/10s ( PI ), 210¡æ/3s ( PET ) |
Surface Treatment:
|
Soft / Hard Ni/Au, Sn / Pb, Primary
Flux, Carbon Coated, Silver Gel Printed |
| Flammability: |
94V-0 (PI), 94VTM-0(PET) |
|
|
|
